SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
2012SD 10DB	SAMSUNG	BGA	23+	1944	View
SPSWH4S42S3GA4NIY0	SAMSUNG	BGA	23+	1940	View
S29AL128P10FAI010	SAMSUNG	BGA	23+	1936	View
GPD14B01-037	SAMSUNG	BGA	23+	1936	View
SLSRGBW815TSNSWS	SAMSUNG	BGA	23+	1936	View
ANA37305	SAMSUNG	FBGA	23+	1936	View
M471A2K43CB1-CRC	SAMSUNG	BGA	23+	1936	View
SPHWH2L3D30ED4TPM3	SAMSUNG	FBGA	23+	1936	View
S5L3210A01	SAMSUNG	FBGA	23+	1936	View
S524C80D41-SCT0	SAMSUNG	BGA	23+	1936	View
S3E80N0X01	SAMSUNG	BGA	23+	1936	View
S3F9454XZZ-DKB4	SAMSUNG	SOJ20	23+	1936	View
S3F80JBBWB-QZ8B	SAMSUNG	BGA	23+	1936	View
S3C2440A40-YQ80	SAMSUNG	BGA	23+	1936	View
S3F9454BZZ-DH94	SAMSUNG	FBGA-60	23+	1936	View
RC6432J181CS	SAMSUNG	TSOP	23+	1936	View
S1A2209A01-D0B0	SAMSUNG	TSOP	23+	1936	View
CL31C102JIFNNNE	SAMSUNG	BGA	23+	1936	View
CL21B474KAFNNNE	SAMSUNG	TSOP	23+	1936	View
CL32A107MQVNNWE	SAMSUNG	BGA	23+	1936	View

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