SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL10A476MR8NZNE	SAMSUNG	DIP-20	23+	3759	View
SE1179LMRDL-NT	SAMSUNG	DIP	23+	3744	View
CL31F105ZBNE	SAMSUNG	BGA	23+	3738	View
SE19HM01-NT	SAMSUNG	DIP-8	23+	3720	View
S5D5520D06-A0	SAMSUNG	QFP	23+	3720	View
S3C2450X53-YL40	SAMSUNG	SOP20	23+	3720	View
CL21B182KBANNNC	SAMSUNG	BGA	23+	3720	View
CL03X104KR3NNNH	SAMSUNG	QFP48	23+	3720	View
CL31C102JHHNNNE	SAMSUNG	DIP	23+	3717	View
CL21B334KAFNNNE	SAMSUNG	QFP	23+	3717	View
S3C70F4XM5-AVB4	SAMSUNG	QFP	23+	3708	View
S5C7214X01-E0R0	SAMSUNG	BGA	23+	3696	View
S3C70F4XJ3-AVB4	SAMSUNG	QFP44	23+	3696	View
CL10B225KP8NFNC	SAMSUNG	QFP-44	23+	3696	View
CIG21L3R3MNE	SAMSUNG	TSSOP	23+	3696	View
CIH10T15NJNC	SAMSUNG	BGA	23+	3696	View
CL21B225KAFNNNE	SAMSUNG	DIP-32	23+	3682	View
S3C2443X40-YL8N	SAMSUNG	SOP	23+	3672	View
CL32A106KBJNNNE	SAMSUNG	QFP80	23+	3661	View
S524A60X81-SC70	SAMSUNG	QFP100	23+	3652	View

Tel

+86 0755-82737730

+86 18676361975