SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S3P830AXZZ-QXRA	SAMSUNG	BGA	23+	3920	View
CL10A225KQ8NNNC 0603 225K 6.3V	SAMSUNG	QFP	23+	3920	View
CIH05T33NJNC	SAMSUNG	TQFP100	23+	3920	View
CL31A226LOHNNNE	SAMSUNG	BGA	23+	3913	View
CL31F106ZPFNNNE	SAMSUNG	QFP	23+	3913	View
CL32A107MQVNFNE	SAMSUNG	QFP	23+	3892	View
CL31F106ZPAE	SAMSUNG	SOP	23+	3892	View
MN101D06FEH	SAMSUNG	BGA	23+	3888	View
CL32B475KBJ4PNE	SAMSUNG	SOP-8	23+	3888	View
CL32A107MQJNNNE	SAMSUNG	BGA	23+	3885	View
CL32B106KBJNNNE	SAMSUNG	SOP-8	23+	3850	View
CL21B224KCFSFNE	SAMSUNG	SOP	23+	3850	View
SPMWHT521MD5WAQ0S0	SAMSUNG	SOP8	23+	3840	View
CL05A475KP5NRNC	SAMSUNG	BGA	23+	3840	View
S1A2206E02	SAMSUNG	QFP48	23+	3816	View
H9DA1GG25HAMMR-4EM	SAMSUNG	QFP	23+	3816	View
CL03A103KP3NNNC	SAMSUNG	DIP-32	23+	3815	View
LVH0221AOA-B1	SAMSUNG	BGA	23+	3808	View
S3P72P9XZZ-QXR9	SAMSUNG	(QFP)	23+	3808	View
CL05B333KO5NNNC	SAMSUNG	QFP	23+	3808	View

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