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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
SC36410A8G-A040 SC36410A8G-A040 SC36410A8G-A040 SAMSUNG QFP 23+ 3504 View
S3C80G9B22-SN79 S3C80G9B22-SN79 S3C80G9B22-SN79 SAMSUNG QFP 23+ 3504 View
CL03C7R5BA3GNNC CL03C7R5BA3GNNC CL03C7R5BA3GNNC SAMSUNG QFP 23+ 3504 View
SIT3361D01 SIT3361D01 SIT3361D01 SAMSUNG QFP44 23+ 3500 View
S3F84B8XZZ-DK98 S3F84B8XZZ-DK98 S3F84B8XZZ-DK98 SAMSUNG DIE 23+ 3500 View
CL31B104MBCNNNC CL31B104MBCNNNC CL31B104MBCNNNC SAMSUNG QFP 23+ 3500 View
SE1159LMHL-NT-BB SE1159LMHL-NT-BB SE1159LMHL-NT-BB SAMSUNG QFP 23+ 3492 View
S5L5015X01-E080 S5L5015X01-E080 S5L5015X01-E080 SAMSUNG QFP 23+ 3492 View
RC1608F10R0CS RC1608F10R0CS RC1608F10R0CS SAMSUNG QFP 23+ 3492 View
CL10F224ZBNC CL10F224ZBNC CL10F224ZBNC SAMSUNG SOP 23+ 3492 View
CL10C680JB81PNC CL10C680JB81PNC CL10C680JB81PNC SAMSUNG BGA 23+ 3492 View
CL43B105KBFNNNE CL43B105KBFNNNE CL43B105KBFNNNE SAMSUNG QFP80 23+ 3486 View
CL21B154KBFNNNE CL21B154KBFNNNE CL21B154KBFNNNE SAMSUNG DIE 23+ 3472 View
CL31C102JHHNNNE CL31C102JHHNNNE CL31C102JHHNNNE SAMSUNG OTP 23+ 3465 View
CL21F684ZAFNNNE CL21F684ZAFNNNE CL21F684ZAFNNNE SAMSUNG QFP160 23+ 3465 View
S6B0107B01-COCX S6B0107B01-COCX S6B0107B01-COCX SAMSUNG SOP 23+ 3456 View
S5L9284E01-QO S5L9284E01-QO S5L9284E01-QO SAMSUNG SOP32 23+ 3456 View
CL10B104KB8NNNC CL10B104KB8NNNC CL10B104KB8NNNC SAMSUNG TSSOP 23+ 3456 View
SP1121NA SP1121NA SP1121NA SAMSUNG BGA 23+ 3432 View
S3P7414DZZ-AQ94 S3P7414DZZ-AQ94 S3P7414DZZ-AQ94 SAMSUNG SOP32 23+ 3432 View