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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K9F5608U0C K9F5608U0C K9F5608U0C SAMSUNG NULL 23+ 2468 View
K8P5616UQA-PI K8P5616UQA-PI K8P5616UQA-PI SAMSUNG BGA 23+ 2468 View
KM62256DLGI-7L KM62256DLGI-7L KM62256DLGI-7L SAMSUNG TSSOP32 23+ 2468 View
K9F1208B0B-JIB0 K9F1208B0B-JIB0 K9F1208B0B-JIB0 SAMSUNG BGA 23+ 2468 View
K8D6316UTM-PI07 K8D6316UTM-PI07 K8D6316UTM-PI07 SAMSUNG DIP-18 23+ 2468 View
KM62256DLG-7 KM62256DLG-7 KM62256DLG-7 SAMSUNG BGA153 23+ 2468 View
K9G4G08U0M-PCB0 K9G4G08U0M-PCB0 K9G4G08U0M-PCB0 SAMSUNG BGA 23+ 2468 View
K9F8G08U0M-PIBO K9F8G08U0M-PIBO K9F8G08U0M-PIBO SAMSUNG TSOP 23+ 2468 View
KM44C256CP-7 KM44C256CP-7 KM44C256CP-7 SAMSUNG BGA 23+ 2468 View
K9K8G08U0A-PCB0 K9K8G08U0A-PCB0 K9K8G08U0A-PCB0 SAMSUNG BGA 23+ 2468 View
K6F1616U6A-EF55 K6F1616U6A-EF55 K6F1616U6A-EF55 SAMSUNG BGA137 23+ 2468 View
K6T0808C1D-TB70 K6T0808C1D-TB70 K6T0808C1D-TB70 SAMSUNG BGA48 23+ 2468 View
K6X0808C1D-DF55 K6X0808C1D-DF55 K6X0808C1D-DF55 SAMSUNG BGA 23+ 2468 View
K6R1008C1C-JC15 K6R1008C1C-JC15 K6R1008C1C-JC15 SAMSUNG DIP 23+ 2468 View
K4S643232H-TC60 K4S643232H-TC60 K4S643232H-TC60 SAMSUNG BGA 23+ 2468 View
K4H510838D-ZCCC K4H510838D-ZCCC K4H510838D-ZCCC SAMSUNG TSOP 23+ 2468 View
K4J55323QG-BC14 K4J55323QG-BC14 K4J55323QG-BC14 SAMSUNG FBGA 23+ 2468 View
KM41C1000BP-8 KM41C1000BP-8 KM41C1000BP-8 SAMSUNG DIP-16 23+ 2464 View
K9F1208U0B-PCB0 K9F1208U0B-PCB0 K9F1208U0B-PCB0 SAMSUNG SMD 23+ 2464 View
K4T1G084QE-HCF7 K4T1G084QE-HCF7 K4T1G084QE-HCF7 SAMSUNG SOP 23+ 2464 View