SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4A8G085WE-BCWE	SAMSUNG	TSOP	23+	1840	View
K9F1G08UOM-PCBO	SAMSUNG	TSOP	23+	1836	View
K9HAG08U1M-PCBO	SAMSUNG	SOJ	23+	1836	View
K9F1208U0B-FIB0	SAMSUNG	FBGA	23+	1836	View
K9F1208UOB-PCBO	SAMSUNG	FBGA	23+	1836	View
KM681000BLTI-7L	SAMSUNG	FBGA	23+	1836	View
KDA0458L-135	SAMSUNG	TSOP66	23+	1836	View
KS5520-01	SAMSUNG	SOJ	23+	1836	View
KM681002AT-12	SAMSUNG	TSOP	23+	1836	View
K9F4008W0A-TCBO	SAMSUNG	FBGA	23+	1836	View
KM44V1000CLJ-7	SAMSUNG	FBGA	23+	1836	View
K7R643682M-EC20	SAMSUNG	BGA-216	23+	1836	View
K6T1008C2E-DB70	SAMSUNG	BGA	23+	1836	View
K6X4008C1F-GF70	SAMSUNG	QFP100	23+	1836	View
K6X1008C2D-TF70	SAMSUNG	FBGA	23+	1836	View
K6R4008V1D-TC10	SAMSUNG	BGA	23+	1836	View
K4F6E3S4HM-MGCJ	SAMSUNG	BGA	23+	1836	View
K4X2G323PC-8GD8	SAMSUNG	BGA	23+	1836	View
K4E6E304ED-EGCE	SAMSUNG	TSSOP	23+	1836	View
K3QF7F70DM-QGCE	SAMSUNG	TSOP66	23+	1836	View

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