SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
KM4164B-10	SAMSUNG	TSOP50	23+	1820	View
K4S281632B-TC1H	SAMSUNG	TSOP54	23+	1820	View
K9GBG08U0M-LCB0	SAMSUNG	BGA	23+	1816	View
KLMCG8GEAC-B001	SAMSUNG	BGA	23+	1816	View
KM29W040AT	SAMSUNG	BGA	23+	1816	View
KAC00F008M-AE77	SAMSUNG	BGA	23+	1816	View
KM68V4002BT-15	SAMSUNG	BGA	23+	1816	View
K9F6408UOA-TCBO	SAMSUNG	BGA	23+	1816	View
KM68U1000ELRG-10L	SAMSUNG	FBGA	23+	1816	View
K9F5608U0B-PCBO	SAMSUNG	BGA	23+	1816	View
KA1000015B-BJTT	SAMSUNG	TSOP66	23+	1816	View
K7Z167288B-HC36	SAMSUNG	FBGA	23+	1816	View
K6F1008U2C-YF70	SAMSUNG	TSOP	23+	1816	View
K6T4008C1B-70	SAMSUNG	BGA	23+	1816	View
K6X8016C3B-UF70	SAMSUNG	BGA	23+	1816	View
K6R1008V1C-TI15	SAMSUNG	BGA8*8	23+	1816	View
K4F640812C-TC60	SAMSUNG	BGA	23+	1816	View
K4S643232F-UC70	SAMSUNG	TSOP54	23+	1816	View
K4S2816320-LP75	SAMSUNG	NA	23+	1816	View
K9F1G08R0B-JIBO	SAMSUNG	BGA	23+	1812	View

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