SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K9G4G08U0A-PIBO	SAMSUNG	BGA	23+	1860	View
K9HCG08U1M-PIBO	SAMSUNG	BGA	23+	1860	View
K6F1616U6C-FF55	SAMSUNG	TSOP-66	23+	1860	View
K6T0808C1D-GB70	SAMSUNG	TSSOP	23+	1860	View
K6X4008C1F-GL70	SAMSUNG	BGA	23+	1860	View
K6R4008V1C-TC15	SAMSUNG	TSOP	23+	1860	View
K4T51163QJ-BCF7	SAMSUNG	BGA	23+	1860	View
K4T51083QI	SAMSUNG	FBGA	23+	1860	View
K4T1G044QF-BCE6	SAMSUNG	BGA	23+	1860	View
K9FAG08UOM-HIBO	SAMSUNG	BGA	23+	1860	View
KM44C256CP-7	SAMSUNG	TSOP	23+	1860	View
KMQX10013M-B419	SAMSUNG	BGA	23+	1856	View
K4H511638B-UCB3	SAMSUNG	TSSOP-54	23+	1856	View
K3QF2F20DA-QGCE	SAMSUNG	TSSOP	23+	1856	View
K7N801801M-QC10	SAMSUNG	BGA	23+	1856	View
K9WAG08U1A-PIB0	SAMSUNG	FBGA	23+	1852	View
K4H560438D-TCBO	SAMSUNG	BGA	23+	1852	View
K9F1208R0C-JIB0	SAMSUNG	TSSOP66	23+	1848	View
KSC2682-O	SAMSUNG	BGA	23+	1848	View
KS2501-15	SAMSUNG	BGA	23+	1848	View

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