SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K3PE7E700M-XGC1	SAMSUNG	BGA153	23+	2820	View
K8D3216UTC-DI07	SAMSUNG	TSOP48	23+	2820	View
KAT00F00RE-D477	SAMSUNG	TSOP-48	23+	2816	View
K9HCG08U1D-PCB0	SAMSUNG	SOP	23+	2816	View
K4A8G165WB-BITD	SAMSUNG	TSOP48	23+	2816	View
K5L5563CAA-077	SAMSUNG	BGA	23+	2816	View
KAL00P004M-DJ55	SAMSUNG	BGA	23+	2812	View
K9F5608U0D-JIB0	SAMSUNG	BGA	23+	2812	View
K4T51163QQ-BCF8	SAMSUNG	TSSOP48	23+	2812	View
KAG00L008A-DGGB	SAMSUNG	SOJ	23+	2808	View
K9F8G08UOM-PIBO	SAMSUNG	SOJ36	23+	2808	View
K4S643232C-TC80	SAMSUNG	TSSOP	23+	2808	View
K9LAG08U0M-PIBO	SAMSUNG	TSOP-32	23+	2808	View
K3P5C1000D-GC10	SAMSUNG	BGA	23+	2808	View
KAG006003A-DJJ5	SAMSUNG	DIP	23+	2804	View
K9F1G08U0D-SIBO	SAMSUNG	TSOP	23+	2804	View
K4H511638C	SAMSUNG	TSSOP	23+	2804	View
KAC00F00JM-AEYY	SAMSUNG	DIP28	23+	2800	View
K9MDG08U5D-PCB0	SAMSUNG	BGA	23+	2800	View
K4J52324KI-HC14	SAMSUNG	LGA	23+	2800	View