SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4B2G0846F-BCMA	SAMSUNG	BGA	23+	2793	View
K4D553238F-GC33	SAMSUNG	TSOP48	23+	2793	View
K9F4G08U0B-SCB0	SAMSUNG	TSSOP	23+	2792	View
K9WAG08U1B-PCBO	SAMSUNG	TSOP48	23+	2792	View
K4E6400812D-JC50	SAMSUNG	SOJ32	23+	2792	View
K9F1208UOC-PIBO	SAMSUNG	BGA153	23+	2788	View
KA8507BD	SAMSUNG	SOP	23+	2788	View
K4W4G1646B-HC11	SAMSUNG	BGA	23+	2788	View
K8S5615ETA-DE7C	SAMSUNG	BGA	23+	2784	View
K9WAG08U1B-PIBO	SAMSUNG	DIP-28	23+	2784	View
K4T51163QB-ZCD5	SAMSUNG	SOP	23+	2784	View
KM736V787T-9	SAMSUNG	BGA	23+	2780	View
KS24C040CSTF	SAMSUNG	QFP	23+	2780	View
K4T1G084QQ-HCF7	SAMSUNG	TSOP	23+	2780	View
KM6264BLG-7	SAMSUNG	BGA	23+	2776	View
K9WAG08U1B-PCB0	SAMSUNG	BGA	23+	2776	View
K4E8E304EE-EGCE	SAMSUNG	DIP	23+	2776	View
KLMAG2GEUF-B04P	SAMSUNG	BGA153	23+	2772	View
K9KAG08U0M-PCB0	SAMSUNG	BGA	23+	2772	View
K4H511638F-LCCC	SAMSUNG	BGA	23+	2772	View