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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
KLM8G2FE38-B001 KLM8G2FE38-B001 KLM8G2FE38-B001 SAMSUNG TSOP 23+ 2124 View
KLUDG4UHDB-B2D1 KLUDG4UHDB-B2D1 KLUDG4UHDB-B2D1 SAMSUNG TSOP32 23+ 2124 View
KM2V7001CM-B706 KM2V7001CM-B706 KM2V7001CM-B706 SAMSUNG SOP-32 23+ 2124 View
KS57P2316Q KS57P2316Q KS57P2316Q SAMSUNG SMD32 23+ 2124 View
K9F1208U0B-JIBO K9F1208U0B-JIBO K9F1208U0B-JIBO SAMSUNG DIP-28 23+ 2124 View
KM44C4100AK-6 KM44C4100AK-6 KM44C4100AK-6 SAMSUNG TSOP 23+ 2124 View
K9K8G08U0A-PIBO K9K8G08U0A-PIBO K9K8G08U0A-PIBO SAMSUNG TSOP-44 23+ 2124 View
K9F2G08UOM-PCBO K9F2G08UOM-PCBO K9F2G08UOM-PCBO SAMSUNG SOP32 23+ 2124 View
KBN00300LM-D438000 KBN00300LM-D438000 KBN00300LM-D438000 SAMSUNG TSOP 23+ 2124 View
KS0107BPCC KS0107BPCC KS0107BPCC SAMSUNG TSOP32 23+ 2124 View
K7I321882M-FC16 K7I321882M-FC16 K7I321882M-FC16 SAMSUNG CAN 23+ 2124 View
K6T0808C1D-TP70 K6T0808C1D-TP70 K6T0808C1D-TP70 SAMSUNG SOP32 23+ 2124 View
K6X14008C1F-UF55 K6X14008C1F-UF55 K6X14008C1F-UF55 SAMSUNG SOP32 23+ 2124 View
K6X4008C1F-GB70 K6X4008C1F-GB70 K6X4008C1F-GB70 SAMSUNG SOP32 23+ 2124 View
K6R1016C1D-UC10 K6R1016C1D-UC10 K6R1016C1D-UC10 SAMSUNG SOP32 23+ 2124 View
K4S643232H-TC60000 K4S643232H-TC60000 K4S643232H-TC60000 SAMSUNG SOP32 23+ 2124 View
K4AAG165WB-MCRC K4AAG165WB-MCRC K4AAG165WB-MCRC SAMSUNG SOP32 23+ 2124 View
K4S561632E-TL75 K4S561632E-TL75 K4S561632E-TL75 SAMSUNG SOP32 23+ 2124 View
KLM8G1GE7C-B021 KLM8G1GE7C-B021 KLM8G1GE7C-B021 SAMSUNG TSOP32 23+ 2120 View
KLMBG4WEBC-B031 KLMBG4WEBC-B031 KLMBG4WEBC-B031 SAMSUNG SOP-28 23+ 2120 View