SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S6B2086X01-TO	SAMSUNG	SOP28	23+	3096	View
SQ3D02600B2JBA	SAMSUNG	NA	23+	3092	View
SPS-HI17	SAMSUNG	DIP24	23+	3088	View
EMIX21A390FNPE	SAMSUNG	TSOP	23+	3084	View
D431000ACZ-70L	SAMSUNG	SOP	23+	3080	View
SWB-QC51	SAMSUNG	QFP	23+	3076	View
H5AN4G6NBJR-UHC	SAMSUNG	DIP	23+	3072	View
74VHC04M	SAMSUNG	BGA	23+	3068	View
CL10F104ZBNC	SAMSUNG	QFP80	23+	3066	View
SLSNNWBA6TSLDHQ-24G-B	SAMSUNG	QFN	23+	3064	View
LMG002S-5202A	SAMSUNG	DIP8	23+	3060	View
TCSVS0J226MAAR	SAMSUNG	SSOP	23+	3056	View
TMC51F-G	SAMSUNG	SOP-16	23+	3052	View
SLSNNWH424TSCXVH	SAMSUNG	DIP24	23+	3048	View
MT48LC4M16A2-75IT	SAMSUNG	QFN	23+	3044	View
NM27C010Q150	SAMSUNG	QFN	23+	3040	View
S29NS512P0SBJW000	SAMSUNG	TSOP	23+	3040	View
S3C2410A20-YOBZ	SAMSUNG	TSOP	23+	3040	View
CL10B223KB8NNNC	SAMSUNG	BGA	23+	3040	View
CL05A435MR5NWNC	SAMSUNG	BGA-153	23+	3040	View

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