SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
TCSCS1A107MCAR	SAMSUNG	SOP24	23+	3200	View
S1M8656A01-F0T0	SAMSUNG	QFP	23+	3200	View
S6B0719X01-BOCY	SAMSUNG	BGA	23+	3200	View
CL31B474KBHNFNE	SAMSUNG	QFP64	23+	3200	View
S5D2400X01-T080	SAMSUNG	SOP32	23+	3200	View
LRX4222T2	SAMSUNG	QFP44	23+	3200	View
CIHP0402R2XQ11NHXC	SAMSUNG	DIP16P	23+	3200	View
SQ5U01950C2JJA	SAMSUNG	BGA	23+	3196	View
S1T3361D01-D0B0.	SAMSUNG	SOP-16	23+	3196	View
SQ5D01950B2JJA	SAMSUNG	SOP	23+	3192	View
S1T2410B02	SAMSUNG	SOP-8	23+	3192	View
S2MPS11B02-6430	SAMSUNG	DIP-16	23+	3188	View
S1D2140B03-D0B0	SAMSUNG	DIP42	23+	3188	View
TCSCS1C106MBAR	SAMSUNG	QFP-44	23+	3184	View
S1T3361D01-S0T0	SAMSUNG	BGA	23+	3184	View
SELC2009	SAMSUNG	SMD	23+	3180	View
S1M8822X02-G0T0	SAMSUNG	QFP44	23+	3180	View
CL03B102KA3NNNC	SAMSUNG	BGA	23+	3178	View
5000-6P-1.9SB	SAMSUNG	BGA	23+	3176	View
S1M8680X01-Z0T0	SAMSUNG	BGA	23+	3176	View

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