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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
CL32B472KIFNNNE CL32B472KIFNNNE CL32B472KIFNNNE SAMSUNG SMD2010 23+ 3136 View
LRX4311XIA LRX4311XIA LRX4311XIA SAMSUNG NA 23+ 3132 View
IFR3386P0T0SE22 IFR3386P0T0SE22 IFR3386P0T0SE22 SAMSUNG NA 23+ 3128 View
GPD14B03-027 GPD14B03-027 GPD14B03-027 SAMSUNG SMD 23+ 3124 View
TCSVS0J476MBAR TCSVS0J476MBAR TCSVS0J476MBAR SAMSUNG SMD 23+ 3120 View
SE15HM02-NT SE15HM02-NT SE15HM02-NT SAMSUNG SMD 23+ 3120 View
S3F9444XZZ-DC94 S3F9444XZZ-DC94 S3F9444XZZ-DC94 SAMSUNG SMD0603 23+ 3120 View
S1A0426C02-S0B0 S1A0426C02-S0B0 S1A0426C02-S0B0 SAMSUNG SMD1210 23+ 3120 View
CL21A475KQFNNNE CL21A475KQFNNNE CL21A475KQFNNNE SAMSUNG DIP 23+ 3120 View
3F441FXZZ-ETRF 3F441FXZZ-ETRF 3F441FXZZ-ETRF SAMSUNG DIP-10L 23+ 3120 View
MLC1036-13 MLC1036-13 MLC1036-13 SAMSUNG DIP-28 23+ 3116 View
IFR12P0T0SE03 IFR12P0T0SE03 IFR12P0T0SE03 SAMSUNG QFP 23+ 3112 View
SFDG80BQ102 SFDG80BQ102 SFDG80BQ102 SAMSUNG DIP 23+ 3108 View
CL10B104KO8NFNC CL10B104KO8NFNC CL10B104KO8NFNC SAMSUNG DIP24 23+ 3108 View
CL32F106ZOINNNE CL32F106ZOINNNE CL32F106ZOINNNE SAMSUNG QFP-80 23+ 3108 View
CL31A475K0NE CL31A475K0NE CL31A475K0NE SAMSUNG ZIP 23+ 3108 View
SWB-A23L SWB-A23L SWB-A23L SAMSUNG SOP-28 23+ 3108 View
FEMEDXXBD6550HAA FEMEDXXBD6550HAA FEMEDXXBD6550HAA SAMSUNG DIP-16 23+ 3104 View
SWL-2470 SWL-2470 SWL-2470 SAMSUNG QFP48 23+ 3100 View
S-524A40X41 S-524A40X41 S-524A40X41 SAMSUNG QFP 23+ 3096 View