SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S3F828BXZZ-QW8B	SAMSUNG	TSSOP	23+	2004	View
S3F84I8XZZ-QZ88	SAMSUNG	FBGA	23+	2004	View
S3C2450XH-40	SAMSUNG	BGA	23+	2004	View
S3C80F9BKW-C0C9	SAMSUNG	BCA	23+	2004	View
CIL21N82NMNE	SAMSUNG	TSOP	23+	2004	View
S1H2198A01-S0	SAMSUNG	TSOP-48	23+	2004	View
CL31F225ZOCNNNC	SAMSUNG	TSOP	23+	2004	View
CL31B226KPHNNNE	SAMSUNG	BGA	23+	2004	View
CL03A105MP3NS5C	SAMSUNG	TSOP50	23+	2004	View
CL21C103JBFNNNE	SAMSUNG	TSOP54	23+	2004	View
CL02C030BO2GNNC	SAMSUNG	TSOP54	23+	2004	View
CL21B105KOFVPNE	SAMSUNG	FBGA	23+	2004	View
CL03A104KQ3NNC	SAMSUNG	FBGA	23+	2004	View
CIGT201610LH2R2MUE	SAMSUNG	TSOP	23+	2004	View
SFDG80BQ102	SAMSUNG	BGA	23+	2000	View
S3C7335X31-QWR5	SAMSUNG	BGA	23+	2000	View
CL32B226KOJNNNE	SAMSUNG	BGA	23+	2000	View
FDS8936A	SAMSUNG	BGA	23+	1996	View
74LS157N	SAMSUNG	BGA	23+	1992	View
SE13Q01-MST	SAMSUNG	BGA	23+	1992	View

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