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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
SAPA1D1-MLF SAPA1D1-MLF SAPA1D1-MLF SAMSUNG TSOP66 23+ 2036 View
SPHWH2L3D30ED4RTN3 SPHWH2L3D30ED4RTN3 SPHWH2L3D30ED4RTN3 SAMSUNG BGA 23+ 2036 View
S5H2112X01-B080 S5H2112X01-B080 S5H2112X01-B080 SAMSUNG TSOP 23+ 2036 View
S5M925DA02-L030 S5M925DA02-L030 S5M925DA02-L030 SAMSUNG BGA 23+ 2036 View
S3C2410A-20 S3C2410A-20 S3C2410A-20 SAMSUNG BGA 23+ 2036 View
S3C3410X01-QARO S3C3410X01-QARO S3C3410X01-QARO SAMSUNG FBGA-84 23+ 2036 View
S3C7235D87-QWR8 S3C7235D87-QWR8 S3C7235D87-QWR8 SAMSUNG TSOP54 23+ 2036 View
S3C7054DB0-SOB4 S3C7054DB0-SOB4 S3C7054DB0-SOB4 SAMSUNG FBGA 23+ 2036 View
S3F9454BZZ-DK94 S3F9454BZZ-DK94 S3F9454BZZ-DK94 SAMSUNG TSOP 23+ 2036 View
S1D2511C01-AO S1D2511C01-AO S1D2511C01-AO SAMSUNG BGA 23+ 2036 View
CL10B392KBNC CL10B392KBNC CL10B392KBNC SAMSUNG SOP 23+ 2036 View
CL05C0220JB5NNNC CL05C0220JB5NNNC CL05C0220JB5NNNC SAMSUNG BGA 23+ 2036 View
CL05A105MP5NNNC CL05A105MP5NNNC CL05A105MP5NNNC SAMSUNG BGA 23+ 2036 View
CL31A226KAHNNNE CL31A226KAHNNNE CL31A226KAHNNNE SAMSUNG TSOP54 23+ 2036 View
CL21A106KAFN3NE CL21A106KAFN3NE CL21A106KAFN3NE SAMSUNG BGA 23+ 2036 View
CL21C300JBANNNC CL21C300JBANNNC CL21C300JBANNNC SAMSUNG tsop 23+ 2036 View
CL31B473MACNBNC CL31B473MACNBNC CL31B473MACNBNC SAMSUNG BGA 23+ 2036 View
CIG22B2R2MLE CIG22B2R2MLE CIG22B2R2MLE SAMSUNG BGA 23+ 2036 View
HED58XXU12 A107 HED58XXU12 A107 HED58XXU12 A107 SAMSUNG FBGA 23+ 2032 View
1206-X7R-25V123K 1206-X7R-25V123K 1206-X7R-25V123K SAMSUNG TSSOP 23+ 2028 View