SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S3F833BXZZ-QX8B	SAMSUNG	BGA	23+	2304	View
S3C9404D13-AVB4	SAMSUNG	BGA	23+	2304	View
S3C2443XL-53	SAMSUNG	BGA	23+	2304	View
CIL21Y100KNE	SAMSUNG	BGA	23+	2304	View
S1L9223A01-QO	SAMSUNG	BGA	23+	2304	View
CL31B125KPCNNNC	SAMSUNG	BGA	23+	2304	View
CL31B224KBFNNNE	SAMSUNG	BGA	23+	2304	View
CL21C150JBANNNC	SAMSUNG	BGA	23+	2304	View
CL05C200JB5NNNC	SAMSUNG	BGA	23+	2304	View
CL02A103KQ2NNNC	SAMSUNG	BGA220	23+	2304	View
CL21B104KBCNNNC	SAMSUNG	BGA	23+	2304	View
CL05B104KO5NNNC	SAMSUNG	BGA	23+	2304	View
CIGT252010LMR47MSE	SAMSUNG	BGA-253	23+	2304	View
S3F9444XZZ-SC94	SAMSUNG	BGA-216	23+	2304	View
CL10B102KBNC	SAMSUNG	BGA	23+	2304	View
S2MPS14X01-6030	SAMSUNG	BGA	23+	2300	View
ZBS242QR	SAMSUNG	BGA	23+	2296	View
SMM-201N	SAMSUNG	BGA	23+	2292	View
88F6290-BHW2	SAMSUNG	FBGA220	23+	2292	View
TCSCS1E105MAAR	SAMSUNG	FBGA	23+	2292	View

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