SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL21A226MQQNNXE	SAMSUNG	BGA	23+	2336	View
CL31B475KBHNNNE	SAMSUNG	BGA153	23+	2336	View
CL21C101JCANNNC	SAMSUNG	TSOP48	23+	2336	View
CL05A104KA5NNNC	SAMSUNG	TSOP48	23+	2336	View
CIG21L1R2MNE	SAMSUNG	TSOP48	23+	2336	View
SPHWHAHDNMA31ZT3D3	SAMSUNG	TSOP48	23+	2336	View
S5D2650X01-Q0R0	SAMSUNG	TSSOP48	23+	2336	View
S3P8629XZZ-QZ89	SAMSUNG	FBGA153	23+	2336	View
CL10C010BNC(0603-1P)	SAMSUNG	BGA	23+	2336	View
CL10C300JB8NNNC	SAMSUNG	TSOP	23+	2336	View
AR1211-S85QFGQ0	SAMSUNG	SOJ28	23+	2332	View
P80C32SFPN	SAMSUNG	TSOP32	23+	2328	View
M393A2K40CB2-CTD	SAMSUNG	TSOP48	23+	2328	View
S3P8615DZZ-AQB5	SAMSUNG	TSOP	23+	2328	View
S1L9223B01-Q0R0	SAMSUNG	TSOP48	23+	2328	View
CL31A226KOCLNNC	SAMSUNG	BGA	23+	2328	View
CIHP0402R2XQ13NHXC	SAMSUNG	BGA63	23+	2328	View
PO1204UC	SAMSUNG	BGA	23+	2324	View
CL32F106ZAHNNNE	SAMSUNG	TSOP48	23+	2324	View
CL21A475KQNE	SAMSUNG	TSOP-40	23+	2324	View