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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4P2E304EQ-AGC2 K4P2E304EQ-AGC2 K4P2E304EQ-AGC2 SAMSUNG TSSOP48 23+ 2852 View
K6R1016C1D-JI10 K6R1016C1D-JI10 K6R1016C1D-JI10 SAMSUNG TSOP-32 23+ 2852 View
KFM2G16Q2M-DEB8 KFM2G16Q2M-DEB8 KFM2G16Q2M-DEB8 SAMSUNG DIP 23+ 2848 View
K9NCG08U5M-PCK0 K9NCG08U5M-PCK0 K9NCG08U5M-PCK0 SAMSUNG DIP 23+ 2848 View
K4J5532QF-GC20 K4J5532QF-GC20 K4J5532QF-GC20 SAMSUNG DIP 23+ 2848 View
KBZ00900PM-A439 KBZ00900PM-A439 KBZ00900PM-A439 SAMSUNG TQFP-48 23+ 2844 View
K9WAG08U1A-PCB0 K9WAG08U1A-PCB0 K9WAG08U1A-PCB0 SAMSUNG TSOP 23+ 2844 View
K4H511638L-LCB3 K4H511638L-LCB3 K4H511638L-LCB3 SAMSUNG TSOP 23+ 2844 View
KBN00700AM-D443 KBN00700AM-D443 KBN00700AM-D443 SAMSUNG DIP8 23+ 2840 View
KLM8G1GESD-B03Q KLM8G1GESD-B03Q KLM8G1GESD-B03Q SAMSUNG BGA 23+ 2840 View
K4E6E304ED-EGCF K4E6E304ED-EGCF K4E6E304ED-EGCF SAMSUNG TSSOP 23+ 2840 View
K5D1257ACC-D090 K5D1257ACC-D090 K5D1257ACC-D090 SAMSUNG NA 23+ 2840 View
K521H12ACH-B050 K521H12ACH-B050 K521H12ACH-B050 SAMSUNG TSSOP 23+ 2840 View
KBE00F003A-D411 KBE00F003A-D411 KBE00F003A-D411 SAMSUNG BGA 23+ 2836 View
KMA2D4P20S-RTK-P KMA2D4P20S-RTK-P KMA2D4P20S-RTK-P SAMSUNG BGA 23+ 2836 View
K4A8G165WB-BCTD K4A8G165WB-BCTD K4A8G165WB-BCTD SAMSUNG TSOP-48 23+ 2836 View
KB100L00WM-A453 KB100L00WM-A453 KB100L00WM-A453 SAMSUNG TSOP 23+ 2832 View
K8P6415UQB-PI4B K8P6415UQB-PI4B K8P6415UQB-PI4B SAMSUNG BGA 23+ 2832 View
K4S283233F-HN K4S283233F-HN K4S283233F-HN SAMSUNG BGA 23+ 2832 View
K7R163684B-FC20 K7R163684B-FC20 K7R163684B-FC20 SAMSUNG TSOP48 23+ 2832 View