SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4S641632H-UC70	SAMSUNG	TSOP	23+	2860	View
K9F4G08UOA-PCBO	SAMSUNG	BGA	23+	2860	View
KST3904TF	SAMSUNG	SOJ	23+	2860	View
K6X0808C1D-DF70	SAMSUNG	BGA	23+	2860	View
KM416S8030T-GL	SAMSUNG	TSOP	23+	2856	View
KAP202N00M-BWEW	SAMSUNG	BGA	23+	2856	View
K4S281632F-UP75	SAMSUNG	TSOP48	23+	2856	View
K4E160411D-BC60	SAMSUNG	SOJ	23+	2856	View
K4T51163QQ-BCE6	SAMSUNG	TSOP	23+	2856	View
K4R271669H-DCS8	SAMSUNG	TSOP	23+	2856	View
K4G20325FD-FC03	SAMSUNG	FBGA	23+	2856	View
K4B2G1646E-BQK0	SAMSUNG	TSSOP-48	23+	2856	View
K4B4G0846R-BHMA	SAMSUNG	DIP-16	23+	2856	View
K4D263238K-VC40	SAMSUNG	BGA	23+	2856	View
K4AAG045WB-MCRC	SAMSUNG	TSSOP-48	23+	2856	View
K4D623238B-QC55	SAMSUNG	BGA	23+	2856	View
K7A323600M-PC20	SAMSUNG	TSOP	23+	2856	View
K7Q161854A-FC16	SAMSUNG	BGA-153	23+	2856	View
KM416C1200CT-6	SAMSUNG	BGA	23+	2852	View
KAP202N00M-BWEW	SAMSUNG	TSOP	23+	2852	View

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