SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4M28323PH-HG75	SAMSUNG	TSOP-32	23+	2975	View
K4B8G1646Q-MCK0	SAMSUNG	TSOP-48	23+	2975	View
K4B4G1646D-BMK0	SAMSUNG	TSOP	23+	2975	View
K4B2G1646F-BCK0	SAMSUNG	DIP	23+	2975	View
K4D623238B-GC40	SAMSUNG	SOJ	23+	2975	View
KM684000CLG-7L	SAMSUNG	TSOP48	23+	2972	View
KLMCG8GESD-B04P	SAMSUNG	BGA	23+	2972	View
K4M281633H-BN75	SAMSUNG	BGA	23+	2972	View
KLM4G1FE3B-B001000	SAMSUNG	TSOP-48	23+	2968	View
KA3361CDTF	SAMSUNG	TSOP48	23+	2968	View
K4G41325FE-HC25	SAMSUNG	TSSOP	23+	2968	View
K4M56323PN-HG60	SAMSUNG	TSOP48	23+	2968	View
KS56C820	SAMSUNG	FBGA	23+	2968	View
K4S64323H-TC60	SAMSUNG	SOP-32	23+	2968	View
K9K2G16UOM-YCBO	SAMSUNG	BGA	23+	2964	View
K9WAG08U1E-SCB0	SAMSUNG	NA	23+	2964	View
K4A4G165WD-BCRC	SAMSUNG	BGA	23+	2964	View
KLMBG4GEND-B031	SAMSUNG	BGA	23+	2960	View
K8D6316UBM-DI07	SAMSUNG	TSSOP	23+	2960	View
K4A4G165WD-BCRC	SAMSUNG	TSOP-48	23+	2960	View

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