SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K9F2808UOB-PCBO	SAMSUNG	SOP	23+	3024	View
K9F2G08UOB-PIBO	SAMSUNG	TSOP	23+	3024	View
K4W1G164QE-HC20	SAMSUNG	TSOP	23+	3024	View
K4B8G1646D-MMK0	SAMSUNG	SOP-32	23+	3024	View
K4B4G1646D-BCK0	SAMSUNG	BGA	23+	3024	View
KA9259BDTF	SAMSUNG	BGA	23+	3024	View
K7A163630B-QC16	SAMSUNG	BGA	23+	3024	View
K5E1H12ACM-D075	SAMSUNG	PLCC	23+	3024	View
K9F2808U0B-PCB0	SAMSUNG	TSSOP	23+	3020	View
KLM4G1FEAC-B031	SAMSUNG	FBGA	23+	3020	View
K4T1G1640G-BCE7	SAMSUNG	SOJ	23+	3020	View
K8P5615UQA-PI4D000	SAMSUNG	TSOP	23+	3016	View
K8D3216UTC-DI07	SAMSUNG	TSOP	23+	3016	View
K4S643232F-TL60	SAMSUNG	TSSOP-48	23+	3016	View
K7I641882M-FC31	SAMSUNG	TSOP	23+	3016	View
KS24C080C	SAMSUNG	QFP	23+	3012	View
K9GAG08UOM-PCBO	SAMSUNG	BGA	23+	3012	View
K4S643232C-TL80	SAMSUNG	TSOP	23+	3012	View
KM681000BLGI-7	SAMSUNG	BGA	23+	3008	View
K9F4G08UOA-PCBO	SAMSUNG	BGA	23+	3008	View

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