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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K9F2808U0C-YCB0 K9F2808U0C-YCB0 K9F2808U0C-YCB0 SAMSUNG SMD 23+ 2828 View
KM29U128T KM29U128T KM29U128T SAMSUNG SMD 23+ 2828 View
K524F2HACA-B050 K524F2HACA-B050 K524F2HACA-B050 SAMSUNG BGA 23+ 2820 View
K5D1258ACC-A025 K5D1258ACC-A025 K5D1258ACC-A025 SAMSUNG QFP100 23+ 2812 View
K2B401825B-QC65 K2B401825B-QC65 K2B401825B-QC65 SAMSUNG SMD 23+ 2226 View
K6R1016V1C-TC10 K6R1016V1C-TC10 K6R1016V1C-TC10 SAMSUNG QFP 23+ 2226 View
KM68400BLG-5L KM68400BLG-5L KM68400BLG-5L SAMSUNG QFN 23+ 2252 View
K9F4G08UOD-SCBO K9F4G08UOD-SCBO K9F4G08UOD-SCBO SAMSUNG BGA 23+ 2252 View
K4S280832I-TC25 K4S280832I-TC25 K4S280832I-TC25 SAMSUNG QFP 23+ 2244 View
K5N5666ATB-BQ12 K5N5666ATB-BQ12 K5N5666ATB-BQ12 SAMSUNG QFP 23+ 2228 View
K2R161882B-FC16 K2R161882B-FC16 K2R161882B-FC16 SAMSUNG BGA 23+ 2696 View
K522F1HACB-B050 K522F1HACB-B050 K522F1HACB-B050 SAMSUNG BGA 23+ 2680 View
K8D3216UBC-PI02 K8D3216UBC-PI02 K8D3216UBC-PI02 SAMSUNG BGA 23+ 2680 View
K5N1229ACC-BQ12 K5N1229ACC-BQ12 K5N1229ACC-BQ12 SAMSUNG BGA 23+ 2680 View
KAT002015E-ARTT KAT002015E-ARTT KAT002015E-ARTT SAMSUNG NA 23+ 2636 View
K9K1G08UOA-PCBO K9K1G08UOA-PCBO K9K1G08UOA-PCBO SAMSUNG BGA 23+ 2632 View
K4E8E324EB-EGCG K4E8E324EB-EGCG K4E8E324EB-EGCG SAMSUNG BGA 23+ 2616 View
K4B4G1646D-BYMA K4B4G1646D-BYMA K4B4G1646D-BYMA SAMSUNG BGA 23+ 2616 View
K4T1G164QG-BIF2 K4T1G164QG-BIF2 K4T1G164QG-BIF2 SAMSUNG BGA 23+ 2600 View
K5R1213ACM-DK25 K5R1213ACM-DK25 K5R1213ACM-DK25 SAMSUNG SMD 23+ 2592 View