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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
KLM2G1DEHE-B101 KLM2G1DEHE-B101 KLM2G1DEHE-B101 SAMSUNG QFN 23+ 4224 View
K5D1H13ACM-D075 K5D1H13ACM-D075 K5D1H13ACM-D075 SAMSUNG BGA 23+ 4216 View
K4S641632D-TL75 K4S641632D-TL75 K4S641632D-TL75 SAMSUNG BGA 23+ 4204 View
K9F1208UOB-PIBO K9F1208UOB-PIBO K9F1208UOB-PIBO SAMSUNG DIP24 23+ 4144 View
K9F5608U0C-JIB0 K9F5608U0C-JIB0 K9F5608U0C-JIB0 SAMSUNG QFP 23+ 4144 View
K6R1008CIC-JC15 K6R1008CIC-JC15 K6R1008CIC-JC15 SAMSUNG QFP 23+ 4144 View
K4H560438E-TCB3 K4H560438E-TCB3 K4H560438E-TCB3 SAMSUNG QFP-128 23+ 4064 View
K4T1G084QF-BCF7 K4T1G084QF-BCF7 K4T1G084QF-BCF7 SAMSUNG QFN 23+ 4004 View
K6X4008C1F-VB7000 K6X4008C1F-VB7000 K6X4008C1F-VB7000 SAMSUNG QFN 23+ 4004 View
K7A803609B-HC20 K7A803609B-HC20 K7A803609B-HC20 SAMSUNG MODULE 23+ 4004 View
K3PE4E00M-XGC1 K3PE4E00M-XGC1 K3PE4E00M-XGC1 SAMSUNG DIP 23+ 4004 View
K4E160811C-BL60 K4E160811C-BL60 K4E160811C-BL60 SAMSUNG QFN 23+ 4004 View
K4J55323QI-BC14 K4J55323QI-BC14 K4J55323QI-BC14 SAMSUNG QFN 23+ 4004 View
K9LAG08U0A-PCB0 K9LAG08U0A-PCB0 K9LAG08U0A-PCB0 SAMSUNG BGA 23+ 2266 View
K9F8008UOM-TCBO K9F8008UOM-TCBO K9F8008UOM-TCBO SAMSUNG TQFP 23+ 2384 View
KMK2X000YM-B314 KMK2X000YM-B314 KMK2X000YM-B314 SAMSUNG QFP 23+ 2395 View
K4S56163LF-ZG25 K4S56163LF-ZG25 K4S56163LF-ZG25 SAMSUNG BGA 23+ 2904 View
K8P3215UQB-PI4B K8P3215UQB-PI4B K8P3215UQB-PI4B SAMSUNG BGA 23+ 2896 View
K521F1GACA-B050 K521F1GACA-B050 K521F1GACA-B050 SAMSUNG DIMM 23+ 2822 View
K4B2G1646Q-BCNB K4B2G1646Q-BCNB K4B2G1646Q-BCNB SAMSUNG BGA 23+ 2840 View