SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4B1G0846F-HCK0	SAMSUNG	QFP	23+	3682	View
K4B2G0846Q-BIH9	SAMSUNG	LQFP64	23+	3682	View
K4B4G1646E-BCNB000	SAMSUNG	BGA	23+	3682	View
K4D263238K-UC50	SAMSUNG	BGA	23+	3682	View
K4T1G164QE-HCF7	SAMSUNG	DIP-30	23+	3661	View
K4S161622E-UC80	SAMSUNG	QFP	23+	3661	View
K4X2G323PC-8GD8	SAMSUNG	QFP	23+	3661	View
K4B2G1646Q-BYKO	SAMSUNG	DIP30	23+	3661	View
K4B8G1646G-BCH9	SAMSUNG	BGA	23+	3661	View
K4B4G1646D-BIK0	SAMSUNG	BGA	23+	3661	View
K4D623238B-QC50	SAMSUNG	QFP	23+	3661	View
KE618U2939WMP	SAMSUNG	BGA	23+	3648	View
K6T1008V2E-GB70	SAMSUNG	BGA	23+	3648	View
K9F1G08U0F-5IB0	SAMSUNG	DIP	23+	3648	View
K4T51163QG-HIE6	SAMSUNG	BGA	23+	3640	View
K4S28163LD-RS75	SAMSUNG	DIP-32	23+	3640	View
K4R271669B-MCK7	SAMSUNG	TSSOP	23+	3640	View
K4S641632K-UC60	SAMSUNG	QFP	23+	3640	View
K4B1G0846G-BCH9	SAMSUNG	SSOP20	23+	3640	View
K4B2G1646F-BFMA	SAMSUNG	BGA	23+	3640	View

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