SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4B4G0846B-HYH9	SAMSUNG	DIP20	23+	3808	View
K8Q2815UQB-PI4B	SAMSUNG	BGA	23+	3808	View
KM41C464Z-10	SAMSUNG	QFP	23+	3808	View
K6T0808C1D-GP70	SAMSUNG	QFP	23+	3808	View
K4E6E304ED-AGCC	SAMSUNG	QFP	23+	3808	View
K3QF1F10EM-AGCF	SAMSUNG	QFP-44	23+	3800	View
K5E1213ACE-A060	SAMSUNG	QFP	23+	3800	View
K521H57ACC-B050	SAMSUNG	BGA	23+	3800	View
K7R321882C-EI20	SAMSUNG	BGA	23+	3800	View
K5N6433ATA-BQ12	SAMSUNG	QFP	23+	3800	View
K4B4G1646E-BCMA	SAMSUNG	NA	23+	3780	View
K4R881869E-GCT9	SAMSUNG	BGA	23+	3773	View
K4B2G0846D-HYH9	SAMSUNG	QFP208	23+	3773	View
K4M51163PC-BG75	SAMSUNG	BGA	23+	3759	View
K4EBE304EB-EGCG	SAMSUNG	DIP64	23+	3759	View
K4S641632N-LC75	SAMSUNG	QFP	23+	3759	View
K4B4G164D-BYK0	SAMSUNG	CDIP42	23+	3759	View
K4B4G1646B-HCMA	SAMSUNG	QFP	23+	3759	View
K4B4G0846E-BCMA	SAMSUNG	DIP30	23+	3759	View
K4D263238F-QC50	SAMSUNG	DIP30	23+	3759	View

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