SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4F640812C-TC60	SAMSUNG	BGA	23+	1816	View
K4S643232F-UC70	SAMSUNG	TSOP54	23+	1816	View
K4S2816320-LP75	SAMSUNG	NA	23+	1816	View
K9F1G08R0B-JIBO	SAMSUNG	BGA	23+	1812	View
K4H561638B-TCBO	SAMSUNG	TSOP44	23+	1812	View
KAG001002A-DJJY	SAMSUNG	BGA	23+	1808	View
K4H511638G-LCCC	SAMSUNG	BGA	23+	1808	View
K9F2808U0C-YIB0	SAMSUNG	TSOP-54	23+	1804	View
K9F8008WOM-TCBO	SAMSUNG	BGA	23+	1804	View
K9F2808U0B-YCB0	SAMSUNG	TSOP	23+	1804	View
KM681000CLG-5	SAMSUNG	FBGA	23+	1804	View
KAG00K007A-DGG5	SAMSUNG	BGA	23+	1804	View
KM416S8030BN-GH	SAMSUNG	BGA	23+	1804	View
KS24C02DCSTF	SAMSUNG	TSOP54	23+	1804	View
K9LBG08U1D-PIBO	SAMSUNG	TSOP-54	23+	1804	View
KLMAG2WEMB-B031	SAMSUNG	QFP100	23+	1804	View
K7N163631B-PC16	SAMSUNG	BGA	23+	1804	View
K6T1008C2C-GF70	SAMSUNG	TSOP50	23+	1804	View
K6X1008C2D-TF55	SAMSUNG	BGA	23+	1804	View
K6R4008C1D-JI10	SAMSUNG	TSOP48	23+	1804	View