SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4F6E3S4HM-MGCJ	SAMSUNG	BGA	23+	1836	View
K4X2G323PC-8GD8	SAMSUNG	BGA	23+	1836	View
K4E6E304ED-EGCE	SAMSUNG	TSSOP	23+	1836	View
K3QF7F70DM-QGCE	SAMSUNG	TSOP66	23+	1836	View
K9F1G08U0M-PCB0	SAMSUNG	BGA	23+	1832	View
KLUBG4G1CE-B0B1	SAMSUNG	BGA	23+	1832	View
K9F4G08U0E-SIB0T	SAMSUNG	BGA	23+	1832	View
K9K2G08UOM-YCB0	SAMSUNG	FBGA178	23+	1832	View
KM48S2020CT-G10	SAMSUNG	BGA96	23+	1832	View
K9F8008WOM-TCBO	SAMSUNG	BGA	23+	1832	View
KS58008N	SAMSUNG	BGA	23+	1832	View
K4S563233F-HN75	SAMSUNG	TSOP54	23+	1832	View
K4S281632C-NC1H	SAMSUNG	TSOP66	23+	1832	View
K4F6E3D4HB-MHCJ	SAMSUNG	FBGA-84	23+	1832	View
K4F170411C-BC50	SAMSUNG	BGA	23+	1832	View
K4S643232H-UC60T00	SAMSUNG	BGA	23+	1832	View
K4M283233H-HN60	SAMSUNG	TSOP66	23+	1832	View
K4E641612E-TC60	SAMSUNG	BGA8*11	23+	1832	View
KLMCG2KETM-B041	SAMSUNG	BGA	23+	1828	View
K4E151612C-TC60	SAMSUNG	TSSOP-86	23+	1828	View