SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
KS0122-S	SAMSUNG	TSOP	23+	2936	View
K4T1G164QJ-BCE7	SAMSUNG	BGA	23+	2936	View
K4T1G164QG-BCE6	SAMSUNG	BGA	23+	2933	View
K4X51163PG-FGC8	SAMSUNG	BGA	23+	2933	View
K4E6E304EE-EGCE	SAMSUNG	BGA	23+	2933	View
K4W4G1646E-BC1A	SAMSUNG	ZIP	23+	2933	View
K4B1G1646G-BYK0	SAMSUNG	DIP	23+	2933	View
K4B2G0846E-BCK0	SAMSUNG	TSOP	23+	2933	View
K4D26323RA-GC28	SAMSUNG	TSOP48	23+	2933	View
KA3S0680RFB-YDTU	SAMSUNG	TSOP	23+	2932	View
KS58006D	SAMSUNG	BGA	23+	2932	View
K4S560832J-UC75	SAMSUNG	SOP	23+	2932	View
K9F8G08UOB-PIBO	SAMSUNG	TSOP48	23+	2928	View
KMB7D1DP30QA-EL/P	SAMSUNG	TSOP	23+	2928	View
K4M563233G-HN75	SAMSUNG	BGA	23+	2928	View
K9F8G08U0B-PIB0	SAMSUNG	SOJ	23+	2924	View
K9GAG08U0M-PIB0	SAMSUNG	BGA153	23+	2924	View
K4M56163PG-BG75	SAMSUNG	BGA	23+	2924	View
K9F2G08U0M-YCB0	SAMSUNG	DIP18	23+	2920	View
K9G4G08U0A-PCB0	SAMSUNG	TSOP	23+	2920	View