SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4A4G165WD-BCRC	SAMSUNG	BGA	23+	2964	View
KLMBG4GEND-B031	SAMSUNG	BGA	23+	2960	View
K8D6316UBM-DI07	SAMSUNG	TSSOP	23+	2960	View
K4A4G165WD-BCRC	SAMSUNG	TSOP-48	23+	2960	View
KMK2U000VM-B604	SAMSUNG	BGA	23+	2956	View
KSC1623-L-MTF	SAMSUNG	BGA-254	23+	2956	View
K4X1G323PE-8GC8	SAMSUNG	TSOP48	23+	2956	View
KM416C2560J-6	SAMSUNG	TSOP	23+	2952	View
K9MDGZ8U5M-SCKO	SAMSUNG	TSOP	23+	2952	View
K4S643232F-TC50	SAMSUNG	BGA	23+	2952	View
K9GAG08UOD	SAMSUNG	ZIP	23+	2948	View
K1S64161CD-BI70T00	SAMSUNG	BGA	23+	2948	View
K4C89093AF-ACFB	SAMSUNG	TQFP-48	23+	2948	View
K9F3208WOA-TIBO	SAMSUNG	BGA	23+	2944	View
K9F2808UOC-YCBO	SAMSUNG	DIP18	23+	2944	View
K4T51163QG-HCF7 001	SAMSUNG	DIP-18	23+	2944	View
KLMEG8UCTA-B041	SAMSUNG	SOP32	23+	2940	View
K9F1G08R0A-JIB0	SAMSUNG	DIP28	23+	2940	View
K4W4G1646B-HC12	SAMSUNG	DIP20	23+	2940	View
KM416C254BJ-5	SAMSUNG	BGA153	23+	2936	View