SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K6R4008C1D-KI10	SAMSUNG	BGA	23+	2248	View
K4S641632K-U60	SAMSUNG	BGA	23+	2248	View
K4T51163QN-BCF7	SAMSUNG	BGA	23+	2248	View
K4S280832K-UC75	SAMSUNG	FBGA153	23+	2247	View
K4G10325FE-HC04	SAMSUNG	BGA	23+	2247	View
K4T51163QJ-BCF7	SAMSUNG	FBGA	23+	2247	View
K4B2G1646F-BMK0	SAMSUNG	NA	23+	2247	View
K4B2G3146G-MQH9	SAMSUNG	BGA	23+	2247	View
K4B4G0846B-HYK0	SAMSUNG	BGA56	23+	2247	View
K4D263238F-UC50	SAMSUNG	FBGA	23+	2247	View
K9F1G08U0C-PCB0	SAMSUNG	FBGA153	23+	2244	View
K4J52324KI-HC08	SAMSUNG	BGA	23+	2244	View
K5A3281DYTB-T755	SAMSUNG	BGA	23+	2244	View
K9K2G08U0M-YCB0	SAMSUNG	BGA	23+	2240	View
K4S281632K-UP75	SAMSUNG	BGA	23+	2240	View
KFG5616U1M-DIBO	SAMSUNG	FBGA	23+	2240	View
K7I643682M-EC30	SAMSUNG	BGA	23+	2240	View
K4S561632E-TL75	SAMSUNG	BGA	23+	2240	View
K4M64163PK-BG1L	SAMSUNG	BGA	23+	2240	View
K7R161882B-EI16	SAMSUNG	BGA	23+	2240	View

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