SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4S281632F-TL75	SAMSUNG	DIP	23+	3076	View
KLMAG2GEAC-B031	SAMSUNG	QFN	23+	3072	View
K9F1208R0B-JIB0	SAMSUNG	DIP-8	23+	3072	View
K4S643232H-TI60	SAMSUNG	DIP8P	23+	3072	View
K9K8G08U0D-SIB0	SAMSUNG	DIP-16	23+	3072	View
K9F8G08UOB-PCBO	SAMSUNG	DIP28	23+	3068	View
K9F4G08UOA-PIBO	SAMSUNG	DIP	23+	3068	View
K4M56163PI-BG75	SAMSUNG	SOP8	23+	3068	View
K3MF9F90MM-MGCE	SAMSUNG	TQFP	23+	3068	View
K4S280832F-TC75	SAMSUNG	DIP-24P	23+	3066	View
K4T51163QI-HCF8	SAMSUNG	SOP-28	23+	3066	View
K4T1G084QE-HCF7	SAMSUNG	SOP16	23+	3066	View
K4B1G1646G-BCMA	SAMSUNG	SIP-9	23+	3066	View
K4B8G1646B-MYK0	SAMSUNG	DIP8	23+	3066	View
K4B4G1646E-BYMA	SAMSUNG	QFP44P	23+	3066	View
K4D263238G-GC2A	SAMSUNG	SOP8	23+	3066	View
K4B1G0846G-BCH9	SAMSUNG	DIP-8	23+	3066	View
K9F8G08U0B-PCB0	SAMSUNG	SOP16	23+	3064	View
KST3906TF	SAMSUNG	SOP-16	23+	3064	View
K4H281638L-LCCC	SAMSUNG	QFP	23+	3064	View