En
search
ACE
SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4B4G164D-BYK0 K4B4G164D-BYK0 K4B4G164D-BYK0 SAMSUNG CDIP42 23+ 3759 View
K4B4G1646B-HCMA K4B4G1646B-HCMA K4B4G1646B-HCMA SAMSUNG QFP 23+ 3759 View
K4B4G0846E-BCMA K4B4G0846E-BCMA K4B4G0846E-BCMA SAMSUNG DIP30 23+ 3759 View
K4D263238F-QC50 K4D263238F-QC50 K4D263238F-QC50 SAMSUNG DIP30 23+ 3759 View
KAT007033M-ARTT KAT007033M-ARTT KAT007033M-ARTT SAMSUNG QFP 23+ 3744 View
KS56C220-97 KS56C220-97 KS56C220-97 SAMSUNG TQFP100 23+ 3744 View
K3QF3F30BM-BGCF K3QF3F30BM-BGCF K3QF3F30BM-BGCF SAMSUNG DIP-42 23+ 3744 View
K9G8G08U0C-SCB0 K9G8G08U0C-SCB0 K9G8G08U0C-SCB0 SAMSUNG BGA 23+ 3744 View
K5E2G12ACM-D075 K5E2G12ACM-D075 K5E2G12ACM-D075 SAMSUNG BGA 23+ 3744 View
K5D1257ACM-D090 K5D1257ACM-D090 K5D1257ACM-D090 SAMSUNG OTP 23+ 3744 View
K3RG5G50MM-MGCJ K3RG5G50MM-MGCJ K3RG5G50MM-MGCJ SAMSUNG BGA 23+ 3744 View
K4U8E3S4AD-MGCL K4U8E3S4AD-MGCL K4U8E3S4AD-MGCL SAMSUNG SOP 23+ 3738 View
K4X51163PC-FGC6 K4X51163PC-FGC6 K4X51163PC-FGC6 SAMSUNG QFP 23+ 3738 View
K4R441869A-MCK7 K4R441869A-MCK7 K4R441869A-MCK7 SAMSUNG BGA 23+ 3738 View
K4H511638J-LCCC K4H511638J-LCCC K4H511638J-LCCC SAMSUNG BGA 23+ 3738 View
K4B4G1646D-BCK0 K4B4G1646D-BCK0 K4B4G1646D-BCK0 SAMSUNG SOP20 23+ 3738 View
K4B2G1646C-HQH9 K4B2G1646C-HQH9 K4B2G1646C-HQH9 SAMSUNG BGA 23+ 3738 View
K4D263238I-VC50 K4D263238I-VC50 K4D263238I-VC50 SAMSUNG BGA 23+ 3738 View
K521H12ACI-B050 K521H12ACI-B050 K521H12ACI-B050 SAMSUNG BGA 23+ 3724 View
K3RG2G20BM-AGCH K3RG2G20BM-AGCH K3RG2G20BM-AGCH SAMSUNG BGA 23+ 3724 View