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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
KS74HCTLS02N KS74HCTLS02N KS74HCTLS02N SAMSUNG TSOP48 23+ 2440 View
KDA0471PL-66 KDA0471PL-66 KDA0471PL-66 SAMSUNG BGA 23+ 2440 View
KLUCG4J1EB-B0B1 KLUCG4J1EB-B0B1 KLUCG4J1EB-B0B1 SAMSUNG TSOP48 23+ 2440 View
K9F1G08U0D-SIB0 K9F1G08U0D-SIB0 K9F1G08U0D-SIB0 SAMSUNG TSOP 23+ 2440 View
K4S560832N-LC75 K4S560832N-LC75 K4S560832N-LC75 SAMSUNG FBGA63 23+ 2440 View
K4S51163PF-PF1L K4S51163PF-PF1L K4S51163PF-PF1L SAMSUNG TOSP44 23+ 2440 View
K4R761869A-GCT9 K4R761869A-GCT9 K4R761869A-GCT9 SAMSUNG TOSP44 23+ 2440 View
K4P2E304EB-PGC2 K4P2E304EB-PGC2 K4P2E304EB-PGC2 SAMSUNG TOSP44 23+ 2440 View
K4T51163QI-HCE7T000 K4T51163QI-HCE7T000 K4T51163QI-HCE7T000 SAMSUNG TOSP44 23+ 2440 View
K4M281633F-BN75 K4M281633F-BN75 K4M281633F-BN75 SAMSUNG TOSP44 23+ 2440 View
K4A8G165WB-BCRC K4A8G165WB-BCRC K4A8G165WB-BCRC SAMSUNG TSOP48 23+ 2440 View
KLMCG8GEND-B031 KLMCG8GEND-B031 KLMCG8GEND-B031 SAMSUNG FBGA160 23+ 2436 View
K9LBG08U0M-PCB0 K9LBG08U0M-PCB0 K9LBG08U0M-PCB0 SAMSUNG DIP 23+ 2436 View
K4S510832B-TC75 K4S510832B-TC75 K4S510832B-TC75 SAMSUNG TSOP48 23+ 2436 View
K3QF4F40BM-FGCF K3QF4F40BM-FGCF K3QF4F40BM-FGCF SAMSUNG TSOP 23+ 2436 View
K9F1G08UOD-BCBO K9F1G08UOD-BCBO K9F1G08UOD-BCBO SAMSUNG SOP 23+ 2432 View
K9F4G08U0A-PCB0 K9F4G08U0A-PCB0 K9F4G08U0A-PCB0 SAMSUNG DIP 23+ 2432 View
K4P4G324EB-GGC2 K4P4G324EB-GGC2 K4P4G324EB-GGC2 SAMSUNG TSOP-32 23+ 2432 View
KM44C256DJ-7 KM44C256DJ-7 KM44C256DJ-7 SAMSUNG NA 23+ 2432 View
K9G8G08U0A-PIBO K9G8G08U0A-PIBO K9G8G08U0A-PIBO SAMSUNG FBGA153 23+ 2432 View