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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
CL21B822KBANNNC CL21B822KBANNNC CL21B822KBANNNC SAMSUNG SOP-8 23+ 3955 View
CL31B475KOHNNNE CL31B475KOHNNNE CL31B475KOHNNNE SAMSUNG SOP-8 23+ 3934 View
CL32F106ZOELNNE CL32F106ZOELNNE CL32F106ZOELNNE SAMSUNG SOP-8 23+ 3920 View
S5P6450GH-53 S5P6450GH-53 S5P6450GH-53 SAMSUNG TSSOP8 23+ 3920 View
S3P830AXZZ-QXRA S3P830AXZZ-QXRA S3P830AXZZ-QXRA SAMSUNG BGA 23+ 3920 View
CL10A225KQ8NNNC 0603 225K 6.3V CL10A225KQ8NNNC 0603 225K 6.3V CL10A225KQ8NNNC 0603 225K 6.3V SAMSUNG QFP 23+ 3920 View
CIH05T33NJNC CIH05T33NJNC CIH05T33NJNC SAMSUNG TQFP100 23+ 3920 View
CL31A226LOHNNNE CL31A226LOHNNNE CL31A226LOHNNNE SAMSUNG BGA 23+ 3913 View
CL31F106ZPFNNNE CL31F106ZPFNNNE CL31F106ZPFNNNE SAMSUNG QFP 23+ 3913 View
CL32A107MQVNFNE CL32A107MQVNFNE CL32A107MQVNFNE SAMSUNG QFP 23+ 3892 View
CL31F106ZPAE CL31F106ZPAE CL31F106ZPAE SAMSUNG SOP 23+ 3892 View
MN101D06FEH MN101D06FEH MN101D06FEH SAMSUNG BGA 23+ 3888 View
CL32B475KBJ4PNE CL32B475KBJ4PNE CL32B475KBJ4PNE SAMSUNG SOP-8 23+ 3888 View
CL32A107MQJNNNE CL32A107MQJNNNE CL32A107MQJNNNE SAMSUNG BGA 23+ 3885 View
CL32B106KBJNNNE CL32B106KBJNNNE CL32B106KBJNNNE SAMSUNG SOP-8 23+ 3850 View
CL21B224KCFSFNE CL21B224KCFSFNE CL21B224KCFSFNE SAMSUNG SOP 23+ 3850 View
SPMWHT521MD5WAQ0S0 SPMWHT521MD5WAQ0S0 SPMWHT521MD5WAQ0S0 SAMSUNG SOP8 23+ 3840 View
CL05A475KP5NRNC CL05A475KP5NRNC CL05A475KP5NRNC SAMSUNG BGA 23+ 3840 View
S1A2206E02 S1A2206E02 S1A2206E02 SAMSUNG QFP48 23+ 3816 View
H9DA1GG25HAMMR-4EM H9DA1GG25HAMMR-4EM H9DA1GG25HAMMR-4EM SAMSUNG QFP 23+ 3816 View