SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL32F106ZAHNNNE	SAMSUNG	BGA	23+	4179	View
CL31C333JBHNNWE	SAMSUNG	DIP-8	23+	4165	View
SEMS12-LF	SAMSUNG	BGA	23+	4160	View
S5L931CX01-T080	SAMSUNG	QFP	23+	4160	View
S3C825AC73-QW8A	SAMSUNG	QFP48	23+	4160	View
CL10C181JB8NNNC	SAMSUNG	QFP64	23+	4160	View
CL05B472KC5VPNC	SAMSUNG	QFP	23+	4160	View
S3C44B0X01L-ED80	SAMSUNG	BGA	23+	4160	View
CL10B104MO8NNNC	SAMSUNG	QFP	23+	4140	View
SPMWHD32AMD7XAV3S0	SAMSUNG	BGA	23+	4128	View
CL32B226KAJNNWE	SAMSUNG	QFP	23+	4123	View
CL10B103KB8NNNC	SAMSUNG	QFP100	23+	4123	View
1206-X7R-50V300-J	SAMSUNG	QFP	23+	4120	View
CL10A105K05LNNC	SAMSUNG	DIP64	23+	4088	View
SC55410DFB-A03R	SAMSUNG	DIP-8	23+	4088	View
S3F9454ZZ	SAMSUNG	DIP-16	23+	4088	View
S1T8507B01-SO	SAMSUNG	BGA	23+	4088	View
CL05B103KA5VPNC	SAMSUNG	QFP	23+	4088	View
3F880AXZZ-QZRA	SAMSUNG	QFP	23+	4088	View
CL10A476MR8NZNE	SAMSUNG	QFP	23+	4032	View