SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL10C2R7CB8NNNC	SAMSUNG	BGA	23+	2260	View
CL03A105MQ3CSNC	SAMSUNG	BGA	23+	2260	View
CIGT201610GMR47MNE	SAMSUNG	BGA	23+	2260	View
GPD14B01-007	SAMSUNG	BGA	23+	2256	View
SEMS13-LF	SAMSUNG	FBGA	23+	2252	View
3C70F4X46-SOB4	SAMSUNG	BGA	23+	2248	View
LMU7142M1	SAMSUNG	BGA	23+	2248	View
SDP1207-FOX-B	SAMSUNG	BGA	23+	2248	View
TCSCS1C476MDAR	SAMSUNG	FBGA	23+	2248	View
SWPA252012S1R5NT	SAMSUNG	BGA	23+	2248	View
S5M8767A01-6130	SAMSUNG	BGA	23+	2248	View
S5M915DX01-L030	SAMSUNG	BGA88	23+	2248	View
S3F9454XZZ	SAMSUNG	BGA107	23+	2248	View
S3C44BOX01-YDR0	SAMSUNG	NA	23+	2248	View
S3C7565X53-QXR5	SAMSUNG	BGA	23+	2248	View
S3F94C4EZZ-VK94	SAMSUNG	BGA	23+	2248	View
S3C9234X54-C0C4	SAMSUNG	BGA69	23+	2248	View
S1T3361D01-SOTO	SAMSUNG	FBGA	23+	2248	View
CL32B106KAJNNNE	SAMSUNG	BGA130	23+	2248	View
CL05C391JB5NNNC	SAMSUNG	BGA	23+	2248	View

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