SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S3P9658AZZSH	SAMSUNG	BGA	23+	2280	View
RC2012J511CS 510R-0805 5%	SAMSUNG	BGA	23+	2280	View
S1A0241A01-I0	SAMSUNG	BGA	23+	2280	View
CL21C060CBANNNC	SAMSUNG	BGA	23+	2280	View
CLA4C100KBNE	SAMSUNG	BGA	23+	2280	View
CL10B333KB8NNNC	SAMSUNG	BGA	23+	2280	View
CL03A103KA3NNNC	SAMSUNG	BGA	23+	2280	View
CL02A103KQ2NNNE	SAMSUNG	Mainplate	23+	2280	View
CL10A334MP6NXNC	SAMSUNG	BGA	23+	2280	View
CL21B225KOFSNNE	SAMSUNG	BGA	23+	2280	View
CIH05T22NJNC	SAMSUNG	FBGA	23+	2280	View
0603C1UF	SAMSUNG	NA	23+	2280	View
AMAN301512ST01	SAMSUNG	FBGA	23+	2276	View
TCSCS0J336MBAR	SAMSUNG	BGA	23+	2276	View
100NF/104K	SAMSUNG	BGA	23+	2276	View
SPMWHT541ML5XAVKS6	SAMSUNG	BGA	23+	2276	View
S6B2086X01-T08	SAMSUNG	BGA	23+	2276	View
S6D0139X31-B0C8	SAMSUNG	BGA	23+	2276	View
S5H2600A01	SAMSUNG	BGA	23+	2276	View
SFRM81DY102	SAMSUNG	BGA	23+	2272	View

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