SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL31B473MACNBNC	SAMSUNG	BGA	23+	2036	View
CIG22B2R2MLE	SAMSUNG	BGA	23+	2036	View
HED58XXU12 A107	SAMSUNG	FBGA	23+	2032	View
1206-X7R-25V123K	SAMSUNG	TSSOP	23+	2028	View
SSN2222A-PF	SAMSUNG	BGA	23+	2024	View
S2MPB03X01-6030/PB30	SAMSUNG	TSSOP	23+	2020	View
SFH942PS101	SAMSUNG	BGA	23+	2020	View
SPSWH1S01S1GQ0IZ1Q	SAMSUNG	BGA	23+	2020	View
SPMWHT541MD5WAT0S3	SAMSUNG	SOJ	23+	2020	View
S6B0107B01-Q0RJ	SAMSUNG	BGA	23+	2020	View
S6B0105A01-Q0RJ	SAMSUNG	BGA	23+	2020	View
S5L5009A03E8K	SAMSUNG	TSOP	23+	2020	View
SWL-2470	SAMSUNG	BGA	23+	2016	View
CL21B106KOQNNNE	SAMSUNG	BGA	23+	2016	View
CL10C050DB8NNNC	SAMSUNG	FBGA	23+	2016	View
SEM2006H	SAMSUNG	TSOP54	23+	2012	View
LCB21B2450F2	SAMSUNG	BGA	23+	2008	View
SQ3U02700D6JFA	SAMSUNG	NA	23+	2004	View
SML2616QTD	SAMSUNG	BGA	23+	2004	View
SEC-300B	SAMSUNG	SOP	23+	2004	View