SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL31B103KHFNMPE	SAMSUNG	SSOP44	23+	2056	View
CL10C332JB8NFNC	SAMSUNG	SOJ	23+	2056	View
CL31B103KHNE	SAMSUNG	SOI-44	23+	2056	View
CL02C220J02ANNE	SAMSUNG	SOP	23+	2056	View
CL21A226MAYNNNE	SAMSUNG	TSOP	23+	2056	View
CL21C470JC61PNC	SAMSUNG	SOJ-32	23+	2056	View
CL10B472KB85PNC	SAMSUNG	BGA	23+	2056	View
CIH05T6N8JNC	SAMSUNG	SOJ	23+	2056	View
CIGT252010TM1R0MLE	SAMSUNG	SOP	23+	2056	View
HED58XXU12	SAMSUNG	TSOP44	23+	2052	View
SPSWH2S24S2G20NVAQ	SAMSUNG	SOJ30	23+	2052	View
SFDG64AQ101	SAMSUNG	SOJ-32	23+	2052	View
SPMWH1228FD5WATKSE	SAMSUNG	TSOP	23+	2052	View
S6A0069X10-QO	SAMSUNG	BGA	23+	2052	View
S6A0070A14-C0CX	SAMSUNG	FBGA60	23+	2052	View
S6A0069X06-C0CX	SAMSUNG	BGA	23+	2052	View
3C825AC28-TWRA	SAMSUNG	BGA	23+	2048	View
TCSCS1C686KDAR	SAMSUNG	TSSOP	23+	2044	View
STLC2416	SAMSUNG	TSOP	23+	2040	View
CL21C102JBCNNNC	SAMSUNG	BGA	23+	2037	View