SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
SE7889-LF QFP	SAMSUNG	BGA	23+	2424	View
MT29F32G08FAAWP:A	SAMSUNG	BGA	23+	2424	View
SFX836KN001	SAMSUNG	TSOP48	23+	2424	View
DX121-C6AHA24DF-LDT	SAMSUNG	BGA	23+	2424	View
S5D0127X01-QO	SAMSUNG	FBGA153	23+	2424	View
S5L9287A01-Q0R0	SAMSUNG	TSOP	23+	2424	View
S3C6410X53-YB40	SAMSUNG	SIP	23+	2424	View
S3P825AXZZ-QW8A	SAMSUNG	TSOP48	23+	2424	View
S3P848AXZZ-QT8A	SAMSUNG	TSOP	23+	2424	View
S3C72M9XF2-C0C9	SAMSUNG	TSOP	23+	2424	View
CIL21S180KNE	SAMSUNG	TSOP	23+	2424	View
S1T3361D01-DO	SAMSUNG	TSOP	23+	2424	View
CL21B471JBANNNC	SAMSUNG	TSOP	23+	2424	View
CL03A104K03NNNC	SAMSUNG	TSOP	23+	2424	View
CL10B331KB8NNNC	SAMSUNG	TSOP	23+	2424	View
CL10A225KQ8NNNC	SAMSUNG	TSOP	23+	2424	View
CL31C101JHFNFNE	SAMSUNG	TSOP	23+	2424	View
CL10C221JB8NNNC	SAMSUNG	TSOP	23+	2424	View
CL05A105KQ5NNNC	SAMSUNG	TSOP	23+	2424	View
CIGT201610GMR47MNE	SAMSUNG	TSOP	23+	2424	View