SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S1D30302F00A000	SAMSUNG	BGA	23+	1676	View
CL21A226MAQNNNE	SAMSUNG	BGA	23+	1676	View
CL10B103KBNC	SAMSUNG	BGA	23+	1676	View
CL10C121JB8NNNC	SAMSUNG	BGA	23+	1676	View
CL31B561KBCNNNC	SAMSUNG	BGA	23+	1676	View
CL21B153KBANFNC	SAMSUNG	BGA	23+	1676	View
CL05A475MP5NRNC	SAMSUNG	BGA	23+	1676	View
CL05A105KA5NQNC	SAMSUNG	NA	23+	1676	View
CIH03T1N0SNC	SAMSUNG	FBGA-96	23+	1676	View
0805 104K 50V/X7R	SAMSUNG	BGA	23+	1676	View
ICPSWR031CR	SAMSUNG	BGA	23+	1672	View
ASD6750GR	SAMSUNG	BGA	23+	1672	View
HE12AF1U12	SAMSUNG	BGA	23+	1672	View
SPMWHT325AD5YBW0SC A2W5S3	SAMSUNG	BGA	23+	1672	View
S6A0069X01-Q0	SAMSUNG	BGA	23+	1672	View
S6C1666X09-60XO	SAMSUNG	BGA	23+	1672	View
S5D5520D01-A0	SAMSUNG	BGA	23+	1672	View
TCSCS0J226KAAR	SAMSUNG	BGA	23+	1668	View
CS1005X7R561K500NR	SAMSUNG	BGA	23+	1664	View
S3P80F9XZZ-S099	SAMSUNG	BGA	23+	1664	View

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