As FPGA performance continues to increase, high-speed FPGA boards face greater challenges in electromagnetic interference (EMI) control and electromagnetic compatibility (EMC) compliance. This article introduces key design techniques for passing EMI/EMC certification, including FPGA PCB design optimization, signal integrity improvement, power integrity management, and high-speed interface design strategies.

For industrial, medical, communication, and aerospace systems, product lifecycles often extend far beyond the typical lifespan of electronic components. While a device may need to operate reliably for 10 years or more, many semiconductor components face rapid technology changes, end-of-life (EOL) risks, and supply chain uncertainties. Through effective FPGA Lifecycle Management, companies can reduce component obsolescence risks, improve system flexibility, and extend the operational lifespan of long-term products. With programmable hardware architecture, long-term availability, and in-field upgrade capabilities, FPGA-based designs provide a sustainable solution for developing products that can evolve and remain competitive for more than a decade.

As FPGA-based edge computing continues to expand in industrial automation, AI vision, medical devices, and communication systems, thermal management has become a critical design challenge. This article explores how engineers can optimize FPGA power consumption, improve heat dissipation, and build more reliable compact FPGA edge devices.