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NXP
NXP products are used in a wide range of applications, covering markets and applications such as secure connected cars, mobile devices, industrial IoT, smart cities, smart homes and communications infrastructure. MAX FPGA GROUP is a distributor of many OEM chips from many well-known manufacturers in the industry, for more information about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
BU2520DX BU2520DX BU2520DX NXP TO-3PF 23+ 3498 View
BU4508AX BU4508AX BU4508AX NXP TO-3P 23+ 4672 View
BU2520AX BU2520AX BU2520AX NXP TO-3P 23+ 4151 View
BUJ302A BUJ302A BUJ302A NXP TO-220AB 23+ 3960 View
BUJ303AD BUJ303AD BUJ303AD NXP TO-252 23+ 3565 View
BUJ105AD BUJ105AD BUJ105AD NXP TO-252 23+ 2876 View
BUJ105A BUJ105A BUJ105A NXP TO-220 23+ 2277 View
BU1706AB/1 BU1706AB/1 BU1706AB/1 NXP TO-263 23+ 1522 View
BUJ303CD BUJ303CD BUJ303CD NXP TO-252 23+ 5880 View
BUJD105AD BUJD105AD BUJD105AD NXP TO-252 23+ 2994 View
BUJ403A BUJ403A BUJ403A NXP TO-220 23+ 4784 View
BUT18AF BUT18AF BUT18AF NXP TO220F 23+ 4466 View
BUT11AF BUT11AF BUT11AF NXP TO220F 23+ 5196 View
BUJ106A BUJ106A BUJ106A NXP TO-220 23+ 4420 View
BUJ303AX BUJ303AX BUJ303AX NXP TO-220F 23+ 3600 View
BUZ102SL BUZ102SL BUZ102SL NXP TO263 23+ 300 View
BUJ103A BUJ103A BUJ103A NXP TO220 23+ 204 View
BUX99 BUX99 BUX99 NXP TO-126 23+ 728 View
BU808FI BU808FI BU808FI NXP TO-3P 23+ 720 View
BUJD203AD,118 BUJD203AD,118 BUJD203AD,118 NXP TO-252 23+ 1000 View