SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S1T2418G01-DOBO	SAMSUNG	TSOP-48	23+	2380	View
CL21B225KOFNNNE	SAMSUNG	TSOP48	23+	2380	View
CL10B474KA8NNNC	SAMSUNG	SOP8	23+	2380	View
CL31C8R2DBNC	SAMSUNG	SOP14	23+	2380	View
CL31B105KBHNNNE	SAMSUNG	ZIP-10	23+	2380	View
CL05B392KB5NNNC	SAMSUNG	TSOP40	23+	2380	View
CL31A476MQHNNNE	SAMSUNG	TSOP48	23+	2380	View
CL05C620JB5NNNC	SAMSUNG	TSSOP	23+	2380	View
CIH05T10NJNC	SAMSUNG	TSOP	23+	2380	View
3F9488XZZ-QZ88	SAMSUNG	TSOP	23+	2380	View
ICPADM300CR	SAMSUNG	3.9MM	23+	2376	View
P01204ND	SAMSUNG	TSOP48	23+	2376	View
S3C1850DR9-SM91	SAMSUNG	FBGA48	23+	2376	View
CL31A106KOHNNNE	SAMSUNG	QFP	23+	2376	View
CIGT252010LM2R2MNE	SAMSUNG	SOP	23+	2376	View
CL21B683KBCNNNC	SAMSUNG	NA	23+	2376	View
SE979MRD-LF	SAMSUNG	TSOP48	23+	2376	View
CL31B103KHFNFNE	SAMSUNG	TSOP	23+	2376	View
HE12AD1U11	SAMSUNG	BGA	23+	2372	View
SFDG75JF101	SAMSUNG	BGA	23+	2372	View

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