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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
TCSCS0J227MCAR TCSCS0J227MCAR TCSCS0J227MCAR SAMSUNG SMD 23+ 2820 View
S3F8647XZZ-AO97 S3F8647XZZ-AO97 S3F8647XZZ-AO97 SAMSUNG WIFI 23+ 2820 View
CL02A224KP2NNNC CL02A224KP2NNNC CL02A224KP2NNNC SAMSUNG BGA 23+ 2820 View
S3F80KBXXS-QZ8B S3F80KBXXS-QZ8B S3F80KBXXS-QZ8B SAMSUNG LED 23+ 2808 View
BTTM43C2SA BTTM43C2SA BTTM43C2SA SAMSUNG TO222 23+ 2796 View
0802 102K 22V/X7R 0802 102K 22V/X7R 0802 102K 22V/X7R SAMSUNG DIP 23+ 2772 View
S1A2224A01-DO S1A2224A01-DO S1A2224A01-DO SAMSUNG NA 23+ 2768 View
CL21B103KBNC CL21B103KBNC CL21B103KBNC SAMSUNG SMD0603 23+ 2768 View
TCSCS1D472MBAR TCSCS1D472MBAR TCSCS1D472MBAR SAMSUNG SMD 23+ 2760 View
CL10C270JBNC CL10C270JBNC CL10C270JBNC SAMSUNG TO-92 23+ 2760 View
CL31B222KBHVPNE CL31B222KBHVPNE CL31B222KBHVPNE SAMSUNG SMD 23+ 2760 View
S3P9234XZZ-ET84 S3P9234XZZ-ET84 S3P9234XZZ-ET84 SAMSUNG SMD 23+ 2760 View
CL31B224KBNE CL31B224KBNE CL31B224KBNE SAMSUNG FBGA 23+ 2760 View
CL32A226KAJNNNE 22UF/22V 226K CL32A226KAJNNNE 22UF/22V 226K CL32A226KAJNNNE 22UF/22V 226K SAMSUNG bga 23+ 2712 View
CL21B102KBNC CL21B102KBNC CL21B102KBNC SAMSUNG SMD 23+ 2712 View
S1T8212A01-V0T0 S1T8212A01-V0T0 S1T8212A01-V0T0 SAMSUNG QFN 23+ 2712 View
S6B33B2B01-B0CY S6B33B2B01-B0CY S6B33B2B01-B0CY SAMSUNG SOP-8 23+ 2700 View
S6T2MLCX01 S6T2MLCX01 S6T2MLCX01 SAMSUNG BGA-169 23+ 2700 View
S3C4230A01-QERO S3C4230A01-QERO S3C4230A01-QERO SAMSUNG QFN 23+ 2644 View
DMBT02421INA DMBT02421INA DMBT02421INA SAMSUNG QFN 23+ 2644 View