SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
RC1608J473CS	SAMSUNG	FBGQ	23+	1632	View
S1T3361D01	SAMSUNG	BGA	23+	1632	View
CL32F226ZOJLNNE	SAMSUNG	BGA	23+	1632	View
CL21B561KBANNNC	SAMSUNG	BGA	23+	1632	View
CL10C152JB8NNNC	SAMSUNG	FBGA	23+	1632	View
CL10C330JB8NNNC	SAMSUNG	FBGA	23+	1632	View
CL31A106KBHNNNE	SAMSUNG	BGA	23+	1632	View
CL31A107MQHNNNE	SAMSUNG	BGA	23+	1632	View
CL10C331JB81PNC	SAMSUNG	BGA	23+	1632	View
CIHP0402R2XQ8N2HXC	SAMSUNG	FBGA	23+	1632	View
0603 103K 50V/X7R	SAMSUNG	BGA	23+	1632	View
HE12BF1U11	SAMSUNG	BGA	23+	1628	View
HE12AE1U11	SAMSUNG	FBGA	23+	1624	View
TCSCM1A225MJAR	SAMSUNG	FBGA	23+	1620	View
SE979LMD-LF	SAMSUNG	BGA	23+	1616	View
SE757MH-LF	SAMSUNG	BGA	23+	1616	View
SE557MH-LF	SAMSUNG	BGA	23+	1616	View
HY11-AB0455	SAMSUNG	BGA	23+	1616	View
SPSWH1S01S1GQ0IZ9R	SAMSUNG	FBGA96	23+	1616	View
S5L840FX01-TORO	SAMSUNG	FBGA	23+	1616	View

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