SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K9ABGD8U0B	SAMSUNG	BGA	23+	2536	View
K9WAG08U1D-SCB0	SAMSUNG	QFP	23+	2536	View
K4W4G1646D-BC11	SAMSUNG	FBGA	23+	2536	View
K4X4G303PB-7GD8	SAMSUNG	TSOP48	23+	2536	View
K4E640812D-TL50	SAMSUNG	TSOP	23+	2536	View
K4S643232H-UC70	SAMSUNG	BGA169	23+	2536	View
K4X2G323PB-8GC8	SAMSUNG	BGA	23+	2534	View
K4F6E3D4HB-MHCJ	SAMSUNG	TSSOP48	23+	2534	View
K4W2G0846P-HC15	SAMSUNG	BGA	23+	2534	View
K4B4G0846E-BCNB	SAMSUNG	SOJ	23+	2534	View
K4B1G1646E-HCK0	SAMSUNG	SOJ	23+	2534	View
K4B2G0846D-HCH9	SAMSUNG	SOP-28	23+	2534	View
K4D263238K-VC50	SAMSUNG	QFP	23+	2534	View
KAG00400FM-AJJY	SAMSUNG	SOJ-28	23+	2532	View
KA7924-ABTU	SAMSUNG	BGA	23+	2532	View
K4W2G1646C-HC11	SAMSUNG	DIP	23+	2532	View
K9F5608UOA	SAMSUNG	SOP-24P	23+	2528	View
KFG1GN6W2D-HIB6	SAMSUNG	TSSOP	23+	2528	View
K4H511638F-LCB3	SAMSUNG	SOP32	23+	2528	View
K9F1208UOB-YIBO	SAMSUNG	QFP	23+	2524	View

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