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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K9MDG08U1M-PCB0 K9MDG08U1M-PCB0 K9MDG08U1M-PCB0 SAMSUNG FBGA 23+ 2580 View
K4S643232H-UI70 K4S643232H-UI70 K4S643232H-UI70 SAMSUNG BGA 23+ 2580 View
KM681000CLG-7 KM681000CLG-7 KM681000CLG-7 SAMSUNG SOP-28 23+ 2580 View
K4T1G084QJ-BIE7 K4T1G084QJ-BIE7 K4T1G084QJ-BIE7 SAMSUNG BGA 23+ 2580 View
K7B161825M-QC75 K7B161825M-QC75 K7B161825M-QC75 SAMSUNG SOP-28 23+ 2580 View
K9F1G08U0C-PIB0T00 K9F1G08U0C-PIB0T00 K9F1G08U0C-PIB0T00 SAMSUNG BGA 23+ 2576 View
KLM4G1EEHM-B101 KLM4G1EEHM-B101 KLM4G1EEHM-B101 SAMSUNG BGA 23+ 2576 View
K4P2G324ED-AGC1 K4P2G324ED-AGC1 K4P2G324ED-AGC1 SAMSUNG FBGA63 23+ 2576 View
K4X2G323PB-6GC6 K4X2G323PB-6GC6 K4X2G323PB-6GC6 SAMSUNG SOP 23+ 2576 View
K4H560838N-LCCC K4H560838N-LCCC K4H560838N-LCCC SAMSUNG TSOP54 23+ 2576 View
K4E640412D-TC50 K4E640412D-TC50 K4E640412D-TC50 SAMSUNG QFP 23+ 2576 View
K4X51163PI-FGC6 K4X51163PI-FGC6 K4X51163PI-FGC6 SAMSUNG BGA 23+ 2576 View
K4B4G1646Q-HYKO K4B4G1646Q-HYKO K4B4G1646Q-HYKO SAMSUNG TSOP 23+ 2576 View
K4B2G1646B-HCF7 K4B2G1646B-HCF7 K4B2G1646B-HCF7 SAMSUNG BGA-221 23+ 2576 View
K4D261638F-TC40 K4D261638F-TC40 K4D261638F-TC40 SAMSUNG SMD 23+ 2576 View
K9F1208U0B-JIB0 K9F1208U0B-JIB0 K9F1208U0B-JIB0 SAMSUNG TSOP48 23+ 2572 View
KS56C821P-74CC KS56C821P-74CC KS56C821P-74CC SAMSUNG TSOP48 23+ 2572 View
K4S641632E-TC60 K4S641632E-TC60 K4S641632E-TC60 SAMSUNG SOP-28 23+ 2572 View
K9F1208ROB-JIBO K9F1208ROB-JIBO K9F1208ROB-JIBO SAMSUNG TSOP 23+ 2568 View
K9LAG08U0M-PCB0 K9LAG08U0M-PCB0 K9LAG08U0M-PCB0 SAMSUNG BGA 23+ 2568 View