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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4B1G1646G-BCKO K4B1G1646G-BCKO K4B1G1646G-BCKO SAMSUNG DIP32 23+ 3108 View
K4B2G1646E-BCNB K4B2G1646E-BCNB K4B2G1646E-BCNB SAMSUNG QFN 23+ 3108 View
K4D263238M-QC55 K4D263238M-QC55 K4D263238M-QC55 SAMSUNG DIP14 23+ 3108 View
K4E6E304ED-EGCG K4E6E304ED-EGCG K4E6E304ED-EGCG SAMSUNG QFP 23+ 3108 View
K7N801801B-PI16 K7N801801B-PI16 K7N801801B-PI16 SAMSUNG DIP 23+ 3108 View
K5R1G13ACD-AK60 K5R1G13ACD-AK60 K5R1G13ACD-AK60 SAMSUNG DIP8 23+ 3108 View
KFM1G16Q2B-DEB8 KFM1G16Q2B-DEB8 KFM1G16Q2B-DEB8 SAMSUNG QFP 23+ 3104 View
KAT008015M-AETT KAT008015M-AETT KAT008015M-AETT SAMSUNG QFP 23+ 3104 View
K4S641632D-TC1H K4S641632D-TC1H K4S641632D-TC1H SAMSUNG SOP 23+ 3104 View
K9K1G08U0M-PIB0 K9K1G08U0M-PIB0 K9K1G08U0M-PIB0 SAMSUNG QFP 23+ 3100 View
K9K8G08U0M-PIB0 K9K8G08U0M-PIB0 K9K8G08U0M-PIB0 SAMSUNG QFN 23+ 3100 View
K4M563233G-HN60 K4M563233G-HN60 K4M563233G-HN60 SAMSUNG SOP 23+ 3100 View
K9LBG08U1D-PCB0 K9LBG08U1D-PCB0 K9LBG08U1D-PCB0 SAMSUNG QFP 23+ 3100 View
K9GBG08U0M-PCB0 K9GBG08U0M-PCB0 K9GBG08U0M-PCB0 SAMSUNG DIP-16 23+ 3096 View
K9F1208UOM-YCBO K9F1208UOM-YCBO K9F1208UOM-YCBO SAMSUNG SOP20 23+ 3096 View
K4S641632D-TC1H K4S641632D-TC1H K4S641632D-TC1H SAMSUNG QFP44 23+ 3096 View
K9WCG08U5M-HIB0 K9WCG08U5M-HIB0 K9WCG08U5M-HIB0 SAMSUNG QFP80 23+ 3096 View
K4T1G164QJ-BIE6 K4T1G164QJ-BIE6 K4T1G164QJ-BIE6 SAMSUNG TSSOP16 23+ 3096 View
K7R161884B-FC16 K7R161884B-FC16 K7R161884B-FC16 SAMSUNG DIP 23+ 3096 View
K9GBG08U0A-PCB0 K9GBG08U0A-PCB0 K9GBG08U0A-PCB0 SAMSUNG SOP 23+ 3092 View