En
search
ACE
SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4T1G084QE-HCE7 K4T1G084QE-HCE7 K4T1G084QE-HCE7 SAMSUNG QFP100 23+ 4032 View
K4D263238G-VC36 K4D263238G-VC36 K4D263238G-VC36 SAMSUNG DIP24 23+ 4032 View
K4H510838G-HCCC K4H510838G-HCCC K4H510838G-HCCC SAMSUNG QFP48 23+ 4032 View
K4B4G0846B-XYK0 K4B4G0846B-XYK0 K4B4G0846B-XYK0 SAMSUNG TQFP 23+ 4032 View
K9F2808UOC-PIBO K9F2808UOC-PIBO K9F2808UOC-PIBO SAMSUNG BGA 23+ 4032 View
K5W2G2GACB-AL50 K5W2G2GACB-AL50 K5W2G2GACB-AL50 SAMSUNG BGA-144 23+ 4012 View
K4V2G303PD-XGC6 K4V2G303PD-XGC6 K4V2G303PD-XGC6 SAMSUNG QFP 23+ 4011 View
K4X1G163PE-FGC3 K4X1G163PE-FGC3 K4X1G163PE-FGC3 SAMSUNG QFP 23+ 4011 View
K4G10325FG-HC04 K4G10325FG-HC04 K4G10325FG-HC04 SAMSUNG QFP 23+ 4011 View
K4N51163QE-ZC25 K4N51163QE-ZC25 K4N51163QE-ZC25 SAMSUNG TQFP 23+ 4011 View
K4B4G0846B-HYKO K4B4G0846B-HYKO K4B4G0846B-HYKO SAMSUNG CDIP16 23+ 4011 View
K4B4G1646D-BCNB K4B4G1646D-BCNB K4B4G1646D-BCNB SAMSUNG BGA 23+ 4011 View
K4D263238E-GC33 K4D263238E-GC33 K4D263238E-GC33 SAMSUNG DIP24 23+ 4011 View
K4M28163PF-BG1L K4M28163PF-BG1L K4M28163PF-BG1L SAMSUNG WLCSP 23+ 4004 View
K6E0804C1E-JC15 K6E0804C1E-JC15 K6E0804C1E-JC15 SAMSUNG DIP8 23+ 4004 View
K7I321882M-FC25 K7I321882M-FC25 K7I321882M-FC25 SAMSUNG QFP 23+ 4004 View
K4J52324QH-BJ1A K4J52324QH-BJ1A K4J52324QH-BJ1A SAMSUNG BGA 23+ 4004 View
K6T1008C2E-GP70 K6T1008C2E-GP70 K6T1008C2E-GP70 SAMSUNG QFP128 23+ 4004 View
K9F4G08UOE-SCBO K9F4G08UOE-SCBO K9F4G08UOE-SCBO SAMSUNG QFP160 23+ 4004 View
KAP29VG00M-D444 KAP29VG00M-D444 KAP29VG00M-D444 SAMSUNG BGA 23+ 4000 View